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| United States Patent Application | 20120106074 |
| Kind Code | A1 |
| Barowski; Harry ;   et al. | May 3, 2012 |
A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.
| Inventors: | Barowski; Harry; (Boeblingen, DE) ; Brunschwiler; Thomas; (Thalwil, CH) ; Harrer; Hubert; (Schoenaich, DE) ; Huber; Andreas; (Leonberg, DE) ; Michel; Bruno; (Zurich, CH) ; Niggemeier; Tim; (Laatzen, DE) ; Paredes; Stephan; (Zurich, CH) ; Supper; Jochen; (Herrenberg, DE) |
| Assignee: |
INTERNATIONAL BUSINESS MACHINES CORPORATION Armonk NY |
| Family ID: | 44883231 |
| Appl. No.: | 12/914697 |
| Filed: | October 28, 2010 |
| Current U.S. Class: | 361/679.54 ; 29/592.1 |
| Current CPC Class: | H01L 23/3672 20130101; H01L 2225/06589 20130101; H01L 2225/06527 20130101; H01L 25/18 20130101 |
| Class at Publication: | 361/679.54 ; 29/592.1 |
| International Class: | G06F 1/20 20060101 G06F001/20; H05K 13/04 20060101 H05K013/04 |